S-7 Pyrophosphate Copper Plating Process
Name：S-7 Pyrophosphate Copper Plating Process
1.High current efficiency, high deposition rate. Produces extra thick deposits on Zinc die casting and avoids blisters and peeling in deposits.
2.Produces uniform and bright deposits showing specular reflectivity. It is an usable mid deposits in iron pipe to save subsequent nickel.
3.Wide current range, good current distribution, easy operation.
4.Single additive for both make-up and replenishment, easy to control.
Make-up: S-7 brightener 2-5ml/L.
Consumption: S-7 brightener 150-250ml/KAH.